Amkor Technology, Inc.
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip-specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. It refers to its flip chip, wafer-level processing and related test services as Advanced Products, and its wirebond packaging, power device packaging and related test services as Mainstream Products. Its Advanced Products include flip chip scale packages, wafer-level packages, and flip chip ball grid array (FCBGA) packages. Its Mainstream Products include leadframe packages, substrate-based wirebond packages, and micro-electro-mechanical systems (MEMS) packages.
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